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New for 2026: the Arora GW1AN and GW3A FPGA families. Read the announcement
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FPGA, design software and IP since 2014

Low-power FPGAs for vision, motor control and edge AI.

Six device families, from instant-on parts for interface bridging to devices with PCIe and multi-gigabit transceivers. The design software is free, and production lead times run in weeks.

Explore products Find your application
About GOWIN

An FPGA earns its place when a processor can't meet the timing or the interface count. Bridging a MIPI camera to an AI module. Closing a motor current loop at a fixed rate. Driving a display from a board the size of a stamp.

GOWIN supplies the devices, the GOWIN EDA design software, IP cores and development boards, so one vendor covers a design from first prototype to volume production.

  • No configuration chip

    LittleBee parts load from internal flash at power-up.

  • Memory in the package

    Arora II options include PSRAM, SDRAM or NOR flash.

  • Hardened interfaces

    MIPI, PCIe and DDR3 in hard logic, leaving the fabric for your design.

  • Processor options

    Arm Cortex-M3 in GW1NS and RISC-V in GW5AST devices.

About the company
138KLUTs
In the largest Arora V device. The smallest LittleBee starts at 1K.
22nm
Process node for Arora V, the highest-performance family.
2.3mm
Edge length of the smallest LittleBee package.
3families
Offer AEC-Q100 qualified automotive-grade parts.
Products

Choose by density, interfaces and memory

Every family uses the same GOWIN EDA flow and IP library, so moving to a larger or smaller device keeps your constraints and IP cores.

22nm SRAM

Arora V

GW5A / GW5AT / GW5AST

For designs that move a lot of data: camera aggregation, high-speed serial links and edge AI front ends.

  • Up to 12.5 Gbps SerDes
  • PCIe 2.1 hard core
  • DDR3 at 1333 Mbps
23K – 138K LUTView family
New in 2026Hybrid LUT4 / LUT6

Arora III

GW3A

Mid-range devices whose mixed LUT4/LUT6 fabric packs wide logic into fewer cells. Built for vision and display pipelines.

  • MIPI D-PHY + DSC
  • eDP interfaces
  • Multi-channel ADC
6K – 90K LUTView family
55nm SRAM

Arora II

GW2A / GW2AR / GW2AN

Mid-density devices with PSRAM, SDRAM or NOR flash inside the package, so a frame buffer needs no extra chip.

  • MIPI CSI-2 / DSI
  • AEC-Q100 options
  • LVDS at 1250 Mbps
10K – 55K LUTView family
New in 2026Non-volatile

Arora I

GW1AN

Low-cost devices with 4 Mbit of user flash and multi-image boot, pin-compatible with competitor parts for second sourcing.

  • Background flash update
  • Integrated ADC
  • 3.3V I/O drive
Small densityView family
55nm flash, non-volatile

LittleBee®

GW1N / GW1NR / GW1NS / GW1NZ

Flash-based devices for I/O bridging and board management. Variants add an Arm Cortex-M3, security functions or Bluetooth LE.

  • MIPI, USB 2.0, I3C
  • Cortex-M3 option
  • Automotive grade
1K – 9K LUTView family
Fixed-function bridge

GoBridge™ ASSP

GWU2X / GWU2U

Fixed-function USB bridges to SPI, I2C, JTAG, GPIO and UART. There is no firmware to write, and a C/C++ host API is included.

  • USB to SPI / I2C / JTAG
  • USB to UART
  • 5 × 5 mm QN32
USB 1.1 full-speedView family
Featured solution

Holoscan Sensor Bridge for edge AI and robotics

An Arora V FPGA takes MIPI camera and sensor feeds and streams them over 10 Gigabit Ethernet to NVIDIA Jetson or IGX. It is spec-compatible with NVIDIA Holoscan and DRIVE Hyperion, so it fits pipelines built on either.

  • Robotics
  • Machine vision
  • Smart cameras
  • ADAS
  • Medical imaging
Request an evaluation kit Reference design
GOWIN Holoscan Sensor Bridge development board
Dev kitDK_ETH-SENSOR-BRIDGE4× SFP+ cages, MIPI D-PHY and C-PHY camera inputs
Sensor bridge connected to an edge AI computer
SystemBridge wired to an edge AI computer
GW5AT-60The Arora V device on the kit, with hard MIPI D-PHY, DDR3 and transceivers
Applications

Start from your market

Each market page lists the recommended families, IP cores and reference designs for that application.

IndustrialField-oriented motor control, PLC I/O expansion and industrial Ethernet.Arora I · Arora III · LittleBeeAutomotiveAEC-Q100 parts with high I/O counts for ADAS cameras, surround view and dashboard displays.Arora II · Arora V · LittleBeeRobotics & Edge AICamera and sensor aggregation into AI processors, including the Holoscan Sensor Bridge.Arora V · Arora IIICommunicationGigabit Ethernet, SFP+ links and protocol bridging in networking equipment.Arora V · Arora IIConsumer & AR/VRMIPI display and camera bridging for headsets, wearables and smart home devices.LittleBee · Arora IMedicalImage capture and processing for ultrasound, endoscopy and portable diagnostics.Arora V · Arora IILED DisplayReceiving cards and video controllers for large LED walls.Arora II · Arora IIICloud & Data CentreBoard management, power sequencing and I/O expansion on server boards.Arora V · LittleBee
Resources

Datasheets, software and design files

One library, searchable by family and document type. Each file is versioned, so you can match a datasheet to the silicon revision you are using.

Design software

GOWIN EDA

Synthesis, place and route, power analysis and an on-chip logic analyser. Free for every GOWIN device, on Windows and Linux.

Download GOWIN EDA
  • EDA ReleaseGOWIN EDA, Windows x64All familiesInstaller · 1.1 GBOct 2026
  • DatasheetArora V GW5AT Series FPGA ProductsArora VPDF · 2.4 MBSep 2026
  • Reference DesignHoloscan Sensor Bridge, GW5AT-60Arora VZIP · 38 MBSep 2026
  • User GuideProgramming and Configuration GuideAll familiesPDF · 6.1 MBAug 2026
  • DatasheetGW3A Series FPGA ProductsArora IIIPDF · 1.9 MBJul 2026
  • App NoteMigrating to GW1AN: pin-compatible replacementArora IPDF · 820 KBJun 2026
  • EDA ReleaseGOWIN EDA, Linux x64All familiesArchive · 1.3 GBOct 2026
  • User GuideLittleBee MIPI D-PHY RX/TX IPLittleBeePDF · 1.2 MBMay 2026
Supply and lifecycle

Design in a 2026 family and it stays supported until at least 2041.

If another vendor discontinues an FPGA on your board, our replacement guide lists the GOWIN parts that fit the same footprint.

10–12 weeksTypical scheduled production lead time
15 yearsMinimum support from first production
EOL replacement guide Lifecycle policy
Newsroom

News and events

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Offices

Sales and engineering support in 11 cities

Headquartered in Guangzhou since 2014. Exeter covers Europe and San Jose covers the Americas, so you speak to an applications engineer in your own working hours.

Asia Pacific

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Europe

  • ExeterInternationalUnited Kingdom--:--

Americas

  • San JoseUnited States--:--
Contact

Talk to GOWIN about your design

Tell us the device, interface or quantity you need and we will route you to the right engineer.

info@gowinsemi.com